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New Plasma Cleaning System for Wafer Level Packaging and Flip Chip ApplicationsBalzers, June 01, 2005 - UCP presents the new plasma cleaning system LFC102. The plasma cleaner was designed for the specific needs in Wafer Level Packaging and Flip Chip applications. It enables a unique reflow process on solder-bumped wafers eliminating the need for solder flux. The LFC102 has a footprint of only 103 in x 105 in (2.6 x 1.4 meters) and its compact design enables easy access to media and components. More information about the LFC102 plasma cleaner Contact: | |||||
