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New system for Wafer Level Packaging and Flip Chip Applications availableBalzers, August 21, 2006 - The LFC102 was designed for the specific needs for process development in Wafer Level Packaging and Flip Chip applications. It combines plasma cleaning and thermal processing and enables a unique reflow process on flux-free solder-bumped wafers. It offers single wafer processing with manual loading. The temperature distribution at the wafer chuck and other important process parameters are logged during operation. The LFC 102 plasma cleaning system was developed in close collaboration with the Fraunhofer Institute for Reliability and Microintegration (IZM). The Fraunhofer IZM is one of the leading experts for microelectronics and microsystems packaging worldwide. More information about the LFC102 plasma cleaner Contact: E-mail: albert.zueger@ucp.li | |||||
