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New Single-Wafer Plasma Cleaning System for Industrial Production AvailableBalzers, December 18, 2006 - UCP presents its new single-wafer plasma cleaning system LFC063 CW. The plasma cleaner is designed for single-wafer cleaning in wafer level packaging (WLP), including MEMS and sensor device packaging. Typical plasma applications include cleaning prior to Solder Bumping, Solder Reflow, or Wafer Bonding. The LFC063 CW uses a newly developed and patented hollow cathode discharge (HCD) plasma process. The HCD plasma source ensures that the wafers are effectively shielded from the primary RF plasma. More information about the LFC063 CW plasma cleaner Contact: E-mail: albert.zueger@ucp.li | |||||
