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New Plasma Cleaner Family LFC063 launchedBalzers, September 05, 2007 - UCP presents its new Plasma Cleaner family LFC063. All plasma cleaning systems are using a newly developed and patented hollow cathode discharge plasma process. No surface erosion or redeposition is caused to the substrates. LFC063 CWThe plasma cleaner is designed for single-wafer cleaning in wafer level packaging (WLP), including MEMS and sensor device packaging. Typical plasma applications include cleaning prior to Solder Bumping, Solder Reflow, or Wafer Bonding. More information about the LFC063 CW plasma cleaner LFC063 CS-V1The stand-alone multi-strip plasma cleaning system offers high throughput with the most reliable handling system. It enables fast, easy and reliable conversion between strip formats. It is best suited for frequently changing substrates during industrial production. More information about the LFC063 CS-V1 plasma cleaner LFC063 CS-V2The stand-alone multi-strip plasma cleaning system offers simultaneous strip loading and unloading. A unique magazine buffer station enables continuous processes. Very high throughputs for defined strip formats will be achived. More information about the LFC063 CS-V2 plasma cleaner Contact: E-mail: albert.zueger@ucp.li | |||||
