LFC060 PS Multi-Strip Plasma Physical Cleaning System - Applications

Wire pull test on QFN substrates with and without sputter cleaning.

The LFC060 PS reliably removes all kinds of contamination on all types of materials and substrates.The LFC060 PS uses plasma physical cleaning, which is a universal cleaning process and most effective for metallic and non-volatile contaminants. Clean surfaces allow lower bond temperatures and result in higher resistance to pull and shear forces after bonding, enhanced adhesion for encapsulation, and increased wettability for underfill.