LFC063 CS-V2 Plasma Cleaning Industrial Production - Applications

Ball shear test on TBGA (no plasma cleaning)	Ball shear test on TBGA (60 sec Ar/H2 plasma)

The Plasma Cleaner CS series reliably removes contaminants such as carbon, oxides, halogens and hydrocarbons from metallic, ceramic and polymer-based substrates. Using a plasma chemical cleaning process, the LFC063 CS-V2 does not cause any surface erosion, redeposition, or device damage. Clean surfaces allow lower bond temperatures and result in higher resistance to pull and shear forces after bonding, enhanced adhesion for encapsulation, and increased wettability for underfill.

Plasma cleaning leads to an increased resistance to shear forces. On cleaned surfaces, gold from the ball bond still adheres to the bond pad.