LFC063 CW Plasma Cleaner for Industrial Single-Wafer Plasma Processing
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Industrial Single-Wafer Plasma Cleaning
The LFC063 CW is designed for single-wafer cleaning in wafer level
packaging (WLP), including MEMS and sensor device packaging. Typical
plasma applications include cleaning prior to Solder Bumping, Solder
Reflow, or Wafer Bonding.
The plasma-chemical cleaning process is
capable of removing contaminants such as carbon, hydrocarbons, oxides
and halogens which results in improved process quality, device
reliability, and production yield.
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No surface erosion or redeposition
At the same time, our patented plasma chemical cleaning process does not
cause any surface erosion or redeposition. The integrated process software and
the tight control of process parameters ensure repeatable and traceable results
from wafer to wafer required in WLP. The optional available load ports are compatible to magazines according to SEMI E47.1.
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