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LFC102 Plasma Cleaning and Reflow System
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Plasma Cleaning System for Process Development
The LFC102 is designed for process development in Wafer Level Packaging
and Flip Chip applications. The system enables a unique reflow process on
flux-free solder-bumped wafers. |
Main advantages
- Reflow - Reflow cycle without solder flux
- Wafer Level Packaging
- Batch System
- Removal of metal oxides and subsequent reflow of solder bumps
- Reflow process fully controlled
- Integrated wafer chuck
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| Typical temperature profile for a solder reflow process in
the LFC102
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Wafer chuck |
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