LFC102 Plasma Cleaning System - Applications

Eutectic Pb/Sn solder bumps before (left) and after (right) plasma reflow. 10 min cleaning in Ar/H2 plasma and subsequent reflow at 200°C.

The first process step consists of a plasma chemical cleaning with our patented hydrogen process. At this stage, metal oxides of the solder constituents are reduced. In a second step, the wafer is heat-treated on the built-in wafer chuck.

Wafers up to 300 mm can be processed at temperatures up to 350°C with an excellent uniformity. The applied temperature profile is stepwise programmable. The flexible process design is suited for soldering at elevated melting points with high-lead solder and lead-free solders (e.g. Au/Sn and Sn/Ag/Cu alloys). Automated process data recording is provided.