LFC102 Plasma Cleaning System - Technical Data

Process Gas consumption

• Argon (Ar): 15 - 50 sccm
• Hydrogen (H₂): 5 - 50 sccm
• Venting gas N₂: 900 litre/h

System

• Dry pumping stage
• Single wafer processing with manual loading
• Integrated wafer chuck

Wafer chuck

• Wafer size: up to 300 mm
• Temperature range: RT to 350°C
• Heating rates: up to 50°C/min
• Temperature uniformity: 3.5°C (min./max.)
• Programmable wafer lift for controlled cool-down after reflow

Option

• Plasma Reflow System for mass production

Dimensions and Weights
 

• All dimensions in mm
• Weight: 750 kg net
• Compact design - easy access to media and components

Patents, standards and certifications

• Patented Hydrogen Process (US 6203637)
• TÜV Report (gas safety)
• SEMI Standard S2 / S8 reported
• ISO 9001 and ISO 14001 registered
• CE certified

Downloads
 

      LFC102 Brochure