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LFC150 Plasma Cleaning System
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Plasma Cleaning System for Industrial Production
The LFC150 is configured for batch plasma processing of strips placed
in slotted magazines and of wafers. The UCP plasma cleaning concept is
based on chemical reactions of gas-phase species with the contaminated
surface. This is accomplished by exposing the substrates to a DC plasma.
The system is equipped with a high vacuum pumping station consisting of a
turbomolecular pump, a rotary vane pump, a high vacuum valve, and a
hydrogen generator. This combination results in unrivaled long-term
surface conservation after cleaning. The LFC150 has an excellent
throughput and is suited for a wide variety of applications.
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Main advantages
- Versatile Ar, H2 - Versatile process development due to controlled
hydrogen supply
- Chip Carrier Wafers
- Batch System
- Ideal for strip-in-magazine cleaning
Spacious loading system for magazines, wafers and other
electronic and optical components:
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Open loading system with magazines |
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Open loading system with wafers |
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