LFC150 Plasma Cleaning System - Applications

A low-pressure plasma process is applied to optimize plasma penetration.The plasma chemical cleaning process takes advantage of low-energy ions and radicals that react with surface contaminants to form volatile compounds.

Pull force vs. wire bond temperature: Plasma cleaning dramatically decreases the required bond temperature and at the same time increases the resistance to the average pull force. This effect is particularly important for temperature-sensitive substrates.

User-friendly touch screen panel (8.4 inch). Easy-to-use system software, stores up to 20 process recipes.

Hydrogen generator for safe and reliable process gas supply (TÜV certified).