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LFC150 L Plasma Cleaning System
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Plasma Cleaning System for Industrial Production
The LFC150 L is configured for batch plasma processing of strips placed
in slotted magazines and of wafers. The UCP plasma cleaning concept is
based on chemical reactions of gas-phase species with the contaminated
surface. This is accomplished by exposing the substrates to a DC plasma.
The system is equipped with a high vacuum pumping station consisting of a
turbomolecular pump and a single stage rotary vane pump. The system is
designed for the use of premixed gases.
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Main advantages
- Premixed Ar/H2 or Ar/N2 - Operation with
premixed process gases
- Chip Carrier Wafers
- Batch System
- Ideal for strip-in-magazine cleaning
Spacious loading system for magazines, wafers and other
electronic and optical components:
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Open loading system with magazines |
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Open loading system with wafers |
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