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NewsSeptember 05, 2007: New Plasma Cleaner Family LFC063 launchedUCP presents its new Plasma Cleaner family LFC063. All plasma cleaning systems are using a newly developed and patented hollow cathode discharge plasma process. No surface erosion or redeposition is caused to the substrates. more... December 18, 2006: New Single-Wafer Plasma Cleaning System for Industrial Production AvailableUCP presents its new single-wafer plasma cleaning system LFC063 CW. The plasma cleaner is designed for single-wafer cleaning in wafer level packaging (WLP), including MEMS and sensor device packaging. more... August 21, 2006: New system for Wafer Level Packaging and Flip Chip Applications availableThe LFC102 was designed for the specific needs for process development in Wafer Level Packaging and Flip Chip applications. It combines plasma cleaning and thermal processing and enables a unique reflow process on flux-free solder-bumped wafers. It offers single wafer processing with manual loading. The temperature distribution at the wafer chuck and other important process parameters are logged during operation. more... July 14, 2006: New Distributor Shanghai Welljump Mechanical and Electronics Technology Co., Ltd. for ChinaStarting today, UCP and the Shanghai Welljump Mechanical and Electronics Technology Co., Ltd. have entered into an agreement about sales and customer support services for UCP plasma cleaning systems in China. more... April, 10, 2006: 0nline Spare Parts Catalog LaunchedStarting today, the new online Spare Parts Catalog is available for UCP customers. At www.ucpgroup.com/spareparts, you may enter your user name and password to access spare parts catalogs for various UCP products. more... June 01, 2005: New Plasma Cleaning System for Wafer Level Packaging and Flip Chip ApplicationsUCP presents the new plasma cleaning system LFC102. The plasma cleaner was designed for the specific needs in Wafer Level Packaging and Flip Chip applications. more... October 16, 2003: New high tech company UCP Processing Ltd. foundedOn October 8, a new high tech company has been founded in the economic space of the Rhine Valley. The Balzers located UCP Processing Ltd. is the result of a successful management buyout by local investors as well as the management and staff of the former Ultra Clean business unit of INFICON. The newly created company has taken over 10 INFICON employees and is operating at the same location as before, which yields synergies for both companies. INFICON will lease part of its premises and offer a number of services to UCP Processing Ltd. more... | |||||
