Publications

Publications on BGA substrates

• Why do we need Plasma Cleaning in Assembly and Packaging?
• Nanomechanical Cantilever Array Sensors
• Plasma Chemical Cleaning of Chip Carrier in a Downstream Hollow Cathode Discharge
• XPS Analysis on Fluorine Removal by Plasma Cleaning
• Integrated Solutions to Bonding BGA Packages: Capillary, Wire, and Machine Considerations
• DC-Hydrogen Plasma Cleaning: A Novel Process for IC-Packaging
• BGA Wire Bonding - The Total Solution
• Reliable BGA Assembly Using Plasma Chemical Cleaning

Publications on silicon wafers

• The Role of Surface Chemistry in Bonding of Standard Silicon Wafers
• Hydrogen Plasma Chemical Cleaning of Metallic Substrates and Silicon Wafers
• Device Quality of In Situ Plasma Cleaning for Silicon Molecular Beam Epitaxy
• Low Temperature Epitaxial Growth by Molecular Beam Epitaxy on Hydrogen-Plasma-Cleaned Silicon Wafers
• Low-Temperature In Situ Cleaning of Silicon Wafers with an Ultra High Vacuum Compatible Plasma Source