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Integrated Solutions to Bonding BGA Packages: Capillary, Wire, and Machine ConsiderationsLeroy Christie, Director Front Line Process Engineering Lee Levine, Principal Metallurgical Engineer Mark Eshelman, Ph.D, Staff Process Engineer AbstractBall Grid Array Packages (BGAs) present unique challenges to the wire bonding process. They ore fine pitch, require long low loops with adequate clearance over voltage and ground bus bar rings, and are built on a laminate substrate. A combined approach, encompassing upgraded Wire bonders and specially designed bonding tools and bonding wire, provides a unique opportunity to develop integrated solutions to these technical challenges. A multi-disciplined team is able to drive the optimization process farther and faster than groups that only focus on smaller areas of the process. In K&S applications tabs located in Pennsylvania, Singapore, and Israel, engineers and customers have worked together to develop solutions that provide robust, high-yield processes. This paper will describe the Designed Experiments (DOEs) and developments that have led to the development of high-yield BGA manufacturing processes.
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