Why do we need Plasma Cleaning in Assembly and Packaging?

Günther Nicolussi
Inficon AG, Balzers, Liechtenstein

Abstract

Surface contamination in Assembly and Packaging (A&P) can have a deteriorating effect on various process steps such as Die Attach, Wire Bonding, Molding, Underfill, and Solder Reflow. Dry etching and wet cleaning are commonly used in the Front-End industry to remove fairly large amounts of material. The physics and chemistry of the process is typically tailored to remove one specific material at the time. In A&P on the other hand, we usually have to deal with multitude of contaminants simultaneously such as all types of residues (left behind from previous processing), material impurities that accumulate on the surface, and contamination that is transferred by extensive handling and poor storing conditions. The mix and type of contamination is often not even known. The challenge is to remove all critical substances without degrading the properties of chip carrier materials and IC performance.

• Published in Future Fab International, Issue 14, 2003, 149
• For further information please contact UCP at ucpgroup@ucp.li

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