Innovative Plasma Processing Technology

The UCP Plasma cleaning concept is based on chemical reactions of gas-phase species with the contaminated surface. This is accomplished by exposing the substrates to a RF- or DC plasma of a particular gas mixture. Plasma-excited atoms and molecules as well as free electrons induce chemical reactions with surface contaminants. This leads to volatile compounds which are released into the gas phase and pumped away.

The process gases utilized are chosen depending upon the specific contamination problem. A combination of argon, hydrogen and/or nitrogen is typically used. Our standard argon/hydrogen process covers a wide variety of cleaning applications, and is particularly advantageous for some polymer applications.

The LFC060 CS is suited for Plasma Chemical Cleaning (PCC) in an RF downstream plasma; the LFC060 PS  is suited for Plasma Physical Cleaning (PPC) in an RF direct plasma.

For a free evaluation or free sample cleaning in our R&D laboratory, contact your UCP sales partner.